Relaxation of additional fees and extension of last date in
filing of various forms with the Ministry of Corporate Affairs-reg.
Circular No: 07/2013, No. 17/187/2011-CL-V,
Dated 20.03.2013
To,
All the Regional Directors
All the Registrar of
Companies,
All Official Liquidators,
All Stakeholders.
In continuation
of the Ministry’s General Circular No: 03/2013 dated 08-02-2013 on the subject
cited, I am directed to inform you that with the approval of competent
authority the time limit for filing and relaxation of additional fee on forms
has been extended till 31-03-2013, as detailed below:-
2. The scenario
arising where the due date was falling before
17/01/2013, however, additional fee increased due to non-filing of documents
between 17/01/2013 and 28/02/2013 (both days inclusive). The affirmative step
based on the ticket raised by ROC and the additional fee mentioned therein,
will be:-
(1) Change of
additional fee applicable against respective SRN in the database;
(2) Regeneration of challan with
revised additional fee;
(3) Extension of validity period of
the challan till 7 days from the date of change;
(4) Sending an e-mail along with
challan to the user requesting him to pay the amount as
per the revised challan. (User may also download the challan from FO Portal.)
3. The other
scenario where all the documents which have expired on or after 17-01-2013 due
to non-submission/re-submission PUCL will be restored back. The validity of
tickets raised till 24-03-2013 will be entertained and users will be given the
time to file the documents within seven days of intimation to user. In case of
failure to file the form within seven days, the form will be marked as NTBR and
no further relaxation will be granted.
4. Further it is
clarified that fee payable for forms on/till 16-01-2013 will remain payable
along with additional fee and relaxation of any additional fee will be
considered for forms on or after 17-01-2013.
5. All other
terms and conditions of the General Circular No.
03/2013 dated 08.02.2013 will remain the same.
.
.
.
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